THERMAL MANAGEMENT IN2.5D SEMICONDUCTOR PACKAGING CROSS-REFERENCE TO RELATED APPLICATIONS

Lower semiconductor dies in2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above...

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Hauptverfasser:	MOHAMMED, ANWAR A, GEKTIN, VADIM
Format:	Patent
Sprache:	eng ; fre
Online-Zugang:	Volltext bestellen
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