BREAK RESISTANT AND SHOCK RESISTANT SAPPHIRE PLATE

The present invention relates to a break resistant sapphire plate and a corresponding production process, wherein the plate comprises a planar sapphire substrate (10) and at least one shock absorbing layer (12) arranged on a surface (11) of the substrate (10), and wherein the layer (12) has a thickn...

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Bibliographische Detailangaben
Hauptverfasser:	NÖLKER, SABINE, BECKMANN, RUDOLF
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CRYSTAL GROWTH DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:	The present invention relates to a break resistant sapphire plate and a corresponding production process, wherein the plate comprises a planar sapphire substrate (10) and at least one shock absorbing layer (12) arranged on a surface (11) of the substrate (10), and wherein the layer (12) has a thickness of between 0.1% to 10% of the thickness of the substrate (10). La présente invention porte sur une plaque en saphir résistante à la cassure et sur un procédé de production correspondant, la plaque comprenant un substrat en saphir plan (10) et au moins une couche absorbant les chocs (12) disposée sur une surface (11) du substrat (10), la couche (12) ayant une épaisseur comprise entre 0,1 % et 10 % de l'épaisseur du substrat (10).