CONDUCTIVE ULTRAFINE PATTERN FORMING METHOD, CONDUCTIVE ULTRAFINE PATTERNS, AND ELECTRIC CIRCUITS

Provided is a method for forming conductive ultrafine patterns having excellent pattern cross-section shapes, by means of a technology that combines a printing process and a plating process. Further provided are: conductive ultrafine patterns, which, by providing excellent adhesion to each interface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIRAKAMI JUN, SAITOU YUKIE, MURAKAWA AKIRA, KATAYAMA YOSHINORI, YOSHIHARA SUNAO, KATSUTA HARUHIKO, FUJIKAWA WATARU
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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