ELECTRONIC COMPONENT PACKAGE

Provided is an electronic component package that enables the electronic component package to be miniaturized and made high performance without decreasing the reliability thereof. The electronic component package is provided with the following: a main substrate; a first electronic component provided...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OTA, YUKITOSHI, HAGIHARA, KIYOMI, ITOU, FUMITO
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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