LASER-INDUCED GAS PLASMA MACHINING

Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser to generate gas plasma. The substrate is then brought in contact with the gas plasma to e...

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Bibliographische Detailangaben
Hauptverfasser:	MATTHEWS, MANYALIBO, BASS, ISAAC, ELHADJ, SELIM, GUSS, GABE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal. La présente invention concerne des techniques d'élimination de matériau d'un substrat. Selon l'invention, un faisceau laser est focalisé à une certaine distance de la surface à traiter. Un gaz est amené au niveau du foyer. Le gaz est dissocié au moyen du laser pour générer un plasma gazeux. Le substrat est ensuite amené en contact avec le plasma gazeux pour permettre une élimination de matériau.