MICROMACHINED ULTRASONIC TRANSDUCER DEVICES WITH METAL-SEMICONDUCTOR CONTACT FOR REDUCED CAPACITIVE CROSS-TALK

Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground pl...

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Bibliographische Detailangaben

Hauptverfasser:	LATEV, DIMITRE, GARDNER, DEANE, LAW, HUNG-FAI STEPHEN, HAJATI, ARMAN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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