HOT MELT ADHESIVE CONTAINING A POLYAMIDE/ POLYOLEFIN HYBRID POLYMER

The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing co...

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Bibliographische Detailangaben
Hauptverfasser:	TICOZZELLI, FABIO, BUTTERBACH, RÜDIGER, SIEPENKOTHEN, JUDITH, MARCHESE, LUCA, SPADA, FABIO, FÖLL, JÜRGEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100. L'invention concerne une composition thermofusible comprenant un copolymère séquencé constitué d'au moins deux séquences en tant que produit de réaction d'un polyamide ayant un poids moléculaire de 5 000 g/mol à 100 000 g/mol et d'un copolymère oléfinique modifié ayant un poids moléculaire de 3 000 à 100 000 g/mol et contenant des groupes anhydride d'acide organiques reliés par des liaisons covalentes à la chaîne polymère, le polyamide ayant un indice d'amine de 0,2 à 10 et le copolymère oléfinique ayant un indice d'acidité de 1 à 100.