HOUSING COMPONENTS OF HANDHELD ELECTRONIC DEVICES

A housing component (2) of a hand-held electronic device, the housing component comprising a cellular material (4) which has a density of from 0.02 to 0,6 g/cc and a Young's modulus of from 32 to 5500 MPa, the cellular material (4) being three-dimensionally shaped to form a substantially resili...

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Bibliographische Detailangaben
Hauptverfasser:	JOLLIFFE, GARRY CHRISTOPHER, ANG, SAM SHEHYEE, POCKNETT, CHAI ZACHARY, BODOFF, MATTHEW EVAN, DOWNS-HONEY, RICHARD ALDEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A housing component (2) of a hand-held electronic device, the housing component comprising a cellular material (4) which has a density of from 0.02 to 0,6 g/cc and a Young's modulus of from 32 to 5500 MPa, the cellular material (4) being three-dimensionally shaped to form a substantially resilient body. There is also disclosed a method of manufacturing a housing component of a hand-held electronic device, the method comprising the steps of: a. providing a cellular material (4); and b. three-dimensionally shaping the cellular material (4) to form a substantially resilient body in the form of a housing component (2) of a hand-held electronic device. L'invention porte sur un composant de boîtier (2) d'un dispositif électronique portatif, le composant de boîtier comprenant un matériau cellulaire (4) qui a une densité de 0,02 à 0,6 g/cc et un module de Young de 32 à 5500 Mpa, le matériau cellulaire (4) étant formé de manière tridimensionnelle pour former un corps sensiblement élastique. L'invention porte également sur un procédé de fabrication d'un composant de boîtier d'un dispositif électronique portatif, le procédé comprenant les étapes suivantes : a. la fourniture d'un matériau cellulaire (4); et b. la formation de manière tridimensionnelle du matériau cellulaire (4) pour former un corps sensiblement élastique dans la forme d'un composant de boîtier (2) d'un dispositif électronique portatif.