PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS
Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat...
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| creator | KANKANALA, PENCHALA N HUDGENS, JEFFREY C SAPKALE, CHANDRAKANT M MUTHUKAMTCHI, KARUPPASAMY MERRY, NIR |
| description | Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat to control flow non-uniformities within the process chamber. Systems and methods including the tiltable valve apparatus are disclosed, as are numerous other aspects.
L'invention concerne un appareil à flux de gaz de chambre de procédé comportant une vanne inclinable. L'appareil à flux de gaz comprend une chambre de procédé adaptée pour contenir un substrat, une sortie de la chambre de procédé comprenant un siège de vanne, et une vanne inclinable conçue et adaptée pour s'incliner par rapport au siège de vanne pour commander les irrégularités d'écoulement au sein de la chambre de procédé. L'invention concerne des systèmes et procédés comprenant l'appareil à vanne inclinable, de même que de nombreux autres aspects. |
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L'invention concerne un appareil à flux de gaz de chambre de procédé comportant une vanne inclinable. L'appareil à flux de gaz comprend une chambre de procédé adaptée pour contenir un substrat, une sortie de la chambre de procédé comprenant un siège de vanne, et une vanne inclinable conçue et adaptée pour s'incliner par rapport au siège de vanne pour commander les irrégularités d'écoulement au sein de la chambre de procédé. L'invention concerne des systèmes et procédés comprenant l'appareil à vanne inclinable, de même que de nombreux autres aspects.</description><language>eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140605&DB=EPODOC&CC=WO&NR=2014085497A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140605&DB=EPODOC&CC=WO&NR=2014085497A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANKANALA, PENCHALA N</creatorcontrib><creatorcontrib>HUDGENS, JEFFREY C</creatorcontrib><creatorcontrib>SAPKALE, CHANDRAKANT M</creatorcontrib><creatorcontrib>MUTHUKAMTCHI, KARUPPASAMY</creatorcontrib><creatorcontrib>MERRY, NIR</creatorcontrib><title>PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS</title><description>Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat to control flow non-uniformities within the process chamber. Systems and methods including the tiltable valve apparatus are disclosed, as are numerous other aspects.
L'invention concerne un appareil à flux de gaz de chambre de procédé comportant une vanne inclinable. L'appareil à flux de gaz comprend une chambre de procédé adaptée pour contenir un substrat, une sortie de la chambre de procédé comprenant un siège de vanne, et une vanne inclinable conçue et adaptée pour s'incliner par rapport au siège de vanne pour commander les irrégularités d'écoulement au sein de la chambre de procédé. L'invention concerne des systèmes et procédés comprenant l'appareil à vanne inclinable, de même que de nombreux autres aspects.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAICPJ3dg0OVnD2cPR1cg1ScHcMVnDz8Q9XcAwIcAxyDAkN1lEIjgwOcfUFMhz9XBR8XUM8_F2CeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGhiYGFqYmluaOhMXGqAPRRKUs</recordid><startdate>20140605</startdate><enddate>20140605</enddate><creator>KANKANALA, PENCHALA N</creator><creator>HUDGENS, JEFFREY C</creator><creator>SAPKALE, CHANDRAKANT M</creator><creator>MUTHUKAMTCHI, KARUPPASAMY</creator><creator>MERRY, NIR</creator><scope>EVB</scope></search><sort><creationdate>20140605</creationdate><title>PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS</title><author>KANKANALA, PENCHALA N ; HUDGENS, JEFFREY C ; SAPKALE, CHANDRAKANT M ; MUTHUKAMTCHI, KARUPPASAMY ; MERRY, NIR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2014085497A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2014</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KANKANALA, PENCHALA N</creatorcontrib><creatorcontrib>HUDGENS, JEFFREY C</creatorcontrib><creatorcontrib>SAPKALE, CHANDRAKANT M</creatorcontrib><creatorcontrib>MUTHUKAMTCHI, KARUPPASAMY</creatorcontrib><creatorcontrib>MERRY, NIR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANKANALA, PENCHALA N</au><au>HUDGENS, JEFFREY C</au><au>SAPKALE, CHANDRAKANT M</au><au>MUTHUKAMTCHI, KARUPPASAMY</au><au>MERRY, NIR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS</title><date>2014-06-05</date><risdate>2014</risdate><abstract>Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat to control flow non-uniformities within the process chamber. Systems and methods including the tiltable valve apparatus are disclosed, as are numerous other aspects.
L'invention concerne un appareil à flux de gaz de chambre de procédé comportant une vanne inclinable. L'appareil à flux de gaz comprend une chambre de procédé adaptée pour contenir un substrat, une sortie de la chambre de procédé comprenant un siège de vanne, et une vanne inclinable conçue et adaptée pour s'incliner par rapport au siège de vanne pour commander les irrégularités d'écoulement au sein de la chambre de procédé. L'invention concerne des systèmes et procédés comprenant l'appareil à vanne inclinable, de même que de nombreux autres aspects.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | PROCESS CHAMBER GAS FLOW APPARATUS, SYSTEMS, AND METHODS |
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