STRENGTHENED LED PACKAGE AND METHOD THEREFOR

Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the flat leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the for...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN, SU PING, GOH, CHIOU BEE, ISHIKAWA, TOMONARI, SOONG, CHEE WENG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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