MAGNETICALLY SEALED WAFER PLATING JIG SYSTEM AND METHOD

A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center sur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ABANES, CHERYL, SCANLAN, CHRISTOPHER, ALDAS, FERDINAND, BLAISDELL, KENNETH
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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