INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS

Integrated circuit packages comprise vias, each of which extends from a pad in communication with an integrated circuit on a semiconductor chip through insulating material overlying the semiconductor chip to an attachment surface facing a substrate. The portion of each via proximate the attachment s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUECHENMEISTER, FRANK, SU, MICHAEL, ZHUOYING, LEI, FU
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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