METHOD FOR MANUFACTURE OF FINE LINE CIRCUITRY

The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer (10) on the smooth surface of a build-up layer (1) and a second conductive layer (11) selected from...

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Bibliographische Detailangaben
Hauptverfasser:	BRUENING, FRANK, JANG, DON, NICHOLS, RICHARD, RIEBEL, HARALD
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer (10) on the smooth surface of a build-up layer (1) and a second conductive layer (11) selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls (5b) of at least one opening (4) which are formed after depositing the first conductive layer. La présente invention concerne un procédé de fabrication d'une circuiterie à ligne fine dans la fabrication de cartes de circuits imprimés, de substrats de circuits intégrés (CI) et analogues. Le procédé utilise une première couche conductrice (10) sur la surface lisse d'une couche de montage (1) et une seconde couche conductrice (11) choisie parmi des polymères électroconducteurs, des métaux nobles colloïdaux et des particules de carbone électroconductrices sur les parois rendues rugueuses (5b) d'au moins une ouverture (4) qui sont formées après dépôt de la première couche conductrice.