SYSTEMS AND METHODS OF PROCESSING SUBSTRATES

Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SPIEGEL, LARRY A, WALSH, THOMAS A, VOGTMANN, MICHAEL R, SMEDLEY, BENJAMIN C, BRAKE, THOMAS E, KALENIAN, WILLIAM J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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