FULLY ENCAPSULATED CONDUCTIVE LINES

Fully encapsulated conductive lines are generally described. For example, a first dielectric layer is formed on a substrate. Copper wiring is disposed below a top surface of the first dielectric layer. A barrier metal layer is formed over the copper wiring, the barrier metal layer flush with the top...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LINDERT, NICK, SINGH, KANWAL JIT, LEE, BYUNGAN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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