PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME

Provided is a printed circuit board for a memory card, including: an insulating layer; a mounting unit which is formed on a first surface of the insulating layer and is electrically connected to a memory device; and a terminal unit which is formed on a second surface of the insulating layer and is e...

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Bibliographische Detailangaben
Hauptverfasser:	JO, YUN KYOUNG, EOM, SAI RAN, PARK, CHANG HWA, LIM, SEOL HEE, KIM, AE RIM
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING RECORD CARRIERS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RECOGNITION OF DATA RECORD CARRIERS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Provided is a printed circuit board for a memory card, including: an insulating layer; a mounting unit which is formed on a first surface of the insulating layer and is electrically connected to a memory device; and a terminal unit which is formed on a second surface of the insulating layer and is electrically connected to electronic apparatuses of an outside, wherein the mounting unit and the terminal unit are formed of metal layers composed of the same materials as each other. L'invention concerne une carte à circuit imprimé pour une carte mémoire qui comprend : une couche d'isolation ; une unité de montage qui est formée sur une première surface de la couche d'isolation et qui est connectée électriquement à un dispositif de mémoire ; et une unité de borne qui est formée sur une deuxième surface de la couche d'isolation et qui est connectée électriquement à des appareils électroniques d'un extérieur, l'unité de montage et l'unité de borne étant formées de couches métalliques composées chacune des mêmes matériaux.