METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind micro vias (6). The method utilizes a metal redox system and pu...

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Bibliographische Detailangaben
Hauptverfasser:	MOSER, CHRISTOPH, TONG, TERRY, CHEN, TED, MIRKOVIC, MARKO, TANG, TIGER, KLOBUS, MARCIN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind micro vias (6). The method utilizes a metal redox system and pulse reverse plating and involves a multilayer laminate comprising a dielectric core layer (1) having an inner copper layer (3), a dielectric outer layer (2) and an outer copper layer (4). A first copper layer (7) is formed by flash plating then copper (8) is electroplated by pulse reverse plating. La présente invention concerne un procédé d'électrodéposition de cuivre pour la fabrication de cartes à circuit imprimé, de substrats de circuit intégré et analogues. Ledit procédé est approprié pour un remplissage de trous traversants (5) et un remplissage de microtraversées borgnes (6) conformes combinés. Le procédé fait appel à un système redox métallique et à un placage par impulsion de courant inverse et implique un stratifié multicouche comprenant une couche de coeur diélectrique (1) comportant une couche intérieure de cuivre (3), une couche extérieure diélectrique (2) et une couche extérieure de cuivre (4). Une première couche de cuivre (7) est formée par placage flash, puis du cuivre (8) est électrodéposé par placage par impulsion de courant inverse.