LOW TEMPERATURE CURING SILOXANE-BASED CROSS-LINKABLE COMPOSITION FOR FORMING INSULATION LAYER
The present invention provides a cross-linkable composition for forming an insulation layer which can be effectively cured at a low temperature, and a method for forming an insulation layer using the same. The cross-linkable composition for forming an insulation layer of the present invention can be...
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| creator | KIM, JONG SOO YEON, SEUNG HO LEE, TAE GWEON YU, BYUNG WOO |
| description | The present invention provides a cross-linkable composition for forming an insulation layer which can be effectively cured at a low temperature, and a method for forming an insulation layer using the same. The cross-linkable composition for forming an insulation layer of the present invention can be cured at a much lower temperature compared with conventional materials for forming an organic insulation layer or an organic-inorganic composite insulation layer, and can form an insulation layer or a coating layer having improved heat resistance and mechanical strength.
La présente invention concerne une composition réticulable pour former une couche isolante qui peut être effectivement durcie à une basse température, et un procédé de formation d'une couche isolante l'utilisant. La composition réticulable pour former une couche isolante de la présente invention peut être durcie à une température bien inférieure par comparaison avec les matières classiques pour former une couche isolante organique ou une couche isolante composite organique-inorganique et peut former une couche isolante ou une couche de revêtement ayant une résistance à la chaleur améliorée et une résistance mécanique améliorée. |
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La présente invention concerne une composition réticulable pour former une couche isolante qui peut être effectivement durcie à une basse température, et un procédé de formation d'une couche isolante l'utilisant. La composition réticulable pour former une couche isolante de la présente invention peut être durcie à une température bien inférieure par comparaison avec les matières classiques pour former une couche isolante organique ou une couche isolante composite organique-inorganique et peut former une couche isolante ou une couche de revêtement ayant une résistance à la chaleur améliorée et une résistance mécanique améliorée.</description><language>eng ; fre ; kor</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130620&DB=EPODOC&CC=WO&NR=2013089474A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130620&DB=EPODOC&CC=WO&NR=2013089474A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JONG SOO</creatorcontrib><creatorcontrib>YEON, SEUNG HO</creatorcontrib><creatorcontrib>LEE, TAE GWEON</creatorcontrib><creatorcontrib>YU, BYUNG WOO</creatorcontrib><title>LOW TEMPERATURE CURING SILOXANE-BASED CROSS-LINKABLE COMPOSITION FOR FORMING INSULATION LAYER</title><description>The present invention provides a cross-linkable composition for forming an insulation layer which can be effectively cured at a low temperature, and a method for forming an insulation layer using the same. The cross-linkable composition for forming an insulation layer of the present invention can be cured at a much lower temperature compared with conventional materials for forming an organic insulation layer or an organic-inorganic composite insulation layer, and can form an insulation layer or a coating layer having improved heat resistance and mechanical strength.
La présente invention concerne une composition réticulable pour former une couche isolante qui peut être effectivement durcie à une basse température, et un procédé de formation d'une couche isolante l'utilisant. La composition réticulable pour former une couche isolante de la présente invention peut être durcie à une température bien inférieure par comparaison avec les matières classiques pour former une couche isolante organique ou une couche isolante composite organique-inorganique et peut former une couche isolante ou une couche de revêtement ayant une résistance à la chaleur améliorée et une résistance mécanique améliorée.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj18Q9XCHH1DXANcgwJDXJVcA4N8vRzVwj29PGPcPRz1XVyDHZ1UXAO8g8O1vXx9PN2dPIBKvL3DfAP9gzx9PdTcPMPAmFfkC5Pv-BQH0ewsI9jpGsQDwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JD_c3MjA0NrCwNDE3cTQ0Jk4VAADLNCA</recordid><startdate>20130620</startdate><enddate>20130620</enddate><creator>KIM, JONG SOO</creator><creator>YEON, SEUNG HO</creator><creator>LEE, TAE GWEON</creator><creator>YU, BYUNG WOO</creator><scope>EVB</scope></search><sort><creationdate>20130620</creationdate><title>LOW TEMPERATURE CURING SILOXANE-BASED CROSS-LINKABLE COMPOSITION FOR FORMING INSULATION LAYER</title><author>KIM, JONG SOO ; YEON, SEUNG HO ; LEE, TAE GWEON ; YU, BYUNG WOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2013089474A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2013</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, JONG SOO</creatorcontrib><creatorcontrib>YEON, SEUNG HO</creatorcontrib><creatorcontrib>LEE, TAE GWEON</creatorcontrib><creatorcontrib>YU, BYUNG WOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, JONG SOO</au><au>YEON, SEUNG HO</au><au>LEE, TAE GWEON</au><au>YU, BYUNG WOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW TEMPERATURE CURING SILOXANE-BASED CROSS-LINKABLE COMPOSITION FOR FORMING INSULATION LAYER</title><date>2013-06-20</date><risdate>2013</risdate><abstract>The present invention provides a cross-linkable composition for forming an insulation layer which can be effectively cured at a low temperature, and a method for forming an insulation layer using the same. The cross-linkable composition for forming an insulation layer of the present invention can be cured at a much lower temperature compared with conventional materials for forming an organic insulation layer or an organic-inorganic composite insulation layer, and can form an insulation layer or a coating layer having improved heat resistance and mechanical strength.
La présente invention concerne une composition réticulable pour former une couche isolante qui peut être effectivement durcie à une basse température, et un procédé de formation d'une couche isolante l'utilisant. La composition réticulable pour former une couche isolante de la présente invention peut être durcie à une température bien inférieure par comparaison avec les matières classiques pour former une couche isolante organique ou une couche isolante composite organique-inorganique et peut former une couche isolante ou une couche de revêtement ayant une résistance à la chaleur améliorée et une résistance mécanique améliorée.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | LOW TEMPERATURE CURING SILOXANE-BASED CROSS-LINKABLE COMPOSITION FOR FORMING INSULATION LAYER |
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