VIA STRUCTURE FOR TRANSMITTING DIFFERENTIAL SIGNALS

A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NADOLNY, JAMES, BIDDLE, GARY ELLSWORTH
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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