SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Provided are: a semiconductor device which has improved heat dissipation performance by increasing the thickness of a part of the circuit pattern, to which a semiconductor element is joined, within a temperature range where the thermal stress caused by temperature change at the time of joining does...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIZAWA TATSUO, IKEDA YOSHINARI, MOCHIDUKI EIJI, TADA SHINJI
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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