ELECTROLESS NICKEL PLATING BATH COMPOSITION

The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt.-%. The plating bath comprises a sulfur-containing organic stabilizing agent. La présente invention porte sur une composition aqueuse d...

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Bibliographische Detailangaben
Hauptverfasser:	JANSSEN, BORIS ALEXANDER, BERA, HOLGER, WEISSBROD, SEBASTIAN, SCHAFSTELLER, BRITTA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt.-%. The plating bath comprises a sulfur-containing organic stabilizing agent. La présente invention porte sur une composition aqueuse de bain de placage pour le dépôt d'un alliage de nickel-phosphore ayant une teneur en phosphore de l'ordre de 12 % en poids. Le bain de placage comprend un agent stabilisant organique contenant du soufre.