DIES PREPEELING APPARATUS AND METHOD

An apparatus (100) and a method for prepeeling semiconductor dies (212) from a dicing tape (200) with the semiconductor dies (212) attached thereon are disclosed. The apparatus (100) comprises a chamber (110) having a bottom base (112), a top opening (114) and an annular sidewall (116) extended upwa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKIAR, HEM, LU, ZHONG, TAI, ENYONG, LIU, NING, ELIPARAKKAL, NADEER, ZHANG, JIDONG, CHIU, CHIN-TIEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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