FLEXIBLE CIRCUIT ASSEMBLY AND METHOD THEREOF

An embedded device (105) is assembled within a flexible circuit assembly (30) with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane (115) to minimize stress effects on the embedded device. The opening (18), for the embedded device, is en...

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Bibliographische Detailangaben
1. Verfasser:	WANG, JAMES JEN-HO
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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Beschreibung
Zusammenfassung:	An embedded device (105) is assembled within a flexible circuit assembly (30) with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane (115) to minimize stress effects on the embedded device. The opening (18), for the embedded device, is enlarged in an intermediate layer (10) to enhance flexibility of the flexible circuit assembly. Un dispositif noyé (105) est assemblé à l'intérieur d'un ensemble circuit flexible (30), le dispositif noyé étant situé intentionnellement à la partie moyenne à proximité du plan central (115) de l'ensemble circuit flexible pour rendre minimaux les effets de contrainte sur le dispositif noyé. L'ouverture (18), pour le dispositif noyé, est agrandie dans une couche intermédiaire (10) pour augmenter la flexibilité de l'ensemble circuit flexible.