ULTRASONIC ASSISTED FILLING OF CAVITIES

In accordance with the present invention, there are provided highly effective methods for filling cavities in a variety of substrates employing a wide range of filler materials. In accordance with a further embodiment of the present invention, there are provided articles prepared employing invention...

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Hauptverfasser: PEREZ, ALBERT, P, STERRETT, TERRY
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creator PEREZ, ALBERT, P
STERRETT, TERRY
description In accordance with the present invention, there are provided highly effective methods for filling cavities in a variety of substrates employing a wide range of filler materials. In accordance with a further embodiment of the present invention, there are provided articles prepared employing invention methods, and novel apparatus which facilitate carrying out invention methods. L'invention concerne des procédés hautement efficaces de remplissage de cavités, formées dans divers substrats, au moyen d'une large gamme de matières de remplissage. Dans une autre forme de réalisation, l'invention concerne des articles élaborés au moyen dedits procédés ainsi qu'un nouveau dispositif qui facilitent la mise en oeuvre des procédés de l'invention.
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title ULTRASONIC ASSISTED FILLING OF CAVITIES
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