ULTRASONIC ASSISTED FILLING OF CAVITIES

In accordance with the present invention, there are provided highly effective methods for filling cavities in a variety of substrates employing a wide range of filler materials. In accordance with a further embodiment of the present invention, there are provided articles prepared employing invention...

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Bibliographische Detailangaben
Hauptverfasser:	PEREZ, ALBERT, P, STERRETT, TERRY
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In accordance with the present invention, there are provided highly effective methods for filling cavities in a variety of substrates employing a wide range of filler materials. In accordance with a further embodiment of the present invention, there are provided articles prepared employing invention methods, and novel apparatus which facilitate carrying out invention methods. L'invention concerne des procédés hautement efficaces de remplissage de cavités, formées dans divers substrats, au moyen d'une large gamme de matières de remplissage. Dans une autre forme de réalisation, l'invention concerne des articles élaborés au moyen dedits procédés ainsi qu'un nouveau dispositif qui facilitent la mise en oeuvre des procédés de l'invention.