DOUBLE PATTERNING WITH INLINE CRITICAL DIMENSION SLIMMING

A method for double patterning a substrate (110, 310) is described. The double patterning method may include a litho/freeze/litho/etch (LFLE) technique that includes a first (critical dimension) CD slimming process to reduce the first CD (124, 325) to a first reduced CD (126, 326) and a second CD sl...

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Bibliographische Detailangaben
Hauptverfasser:	DUNN, SHANNON, W, HETZER, DAVE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A method for double patterning a substrate (110, 310) is described. The double patterning method may include a litho/freeze/litho/etch (LFLE) technique that includes a first (critical dimension) CD slimming process to reduce the first CD (124, 325) to a first reduced CD (126, 326) and a second CD slimming process to reduce the second CD (144, 326) to a second reduced CD (146, 335). L'invention concerne un procédé de double modelage des contours d'un substrat (110, 130). Le procédé de double modelage des contours peut faire appel à une technique de lithographie/gel/lithographie/gravure (LFLE) qui comprend un premier procédé d'amincissement de CD (dimension critique) pour réduire la première CD (124, 325) à une première CD réduite (126, 326) et un second procédé d'amincissement de CD pour réduire la seconde CD (144, 326) à une seconde CD réduite (146, 335).