METHOD FOR BONDING COMPONENTS OF A SPUTTERING TARGET, A BONDED ASSEMBLY OF SPUTTERING TARGET COMPONENTS AND THE USE THEREOF
The invention describes a method for bonding components of a sputtering target, comprising the following steps: providing a first component and a second component, the harder of which has undercut protrusions; positioning them against each other; and pressing them towards each other resulting in a p...
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Format: | Patent |
Sprache: | eng ; fre |
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