FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT

Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application. L'invention porte sur un moyen pour améliorer l'adhérence entre un film de recouvrement de circuits flexibles et une matière d'enrobage dans...

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Bibliographische Detailangaben
Hauptverfasser:	PALANISWAMY, RAVI, TAN, FONG LIANG, IMKEN, RONALD L, GORRELL, ROBIN E
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
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Beschreibung
Zusammenfassung:	Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application. L'invention porte sur un moyen pour améliorer l'adhérence entre un film de recouvrement de circuits flexibles et une matière d'enrobage dans une application aux imprimantes à jet d'encre.