PACKAGE HAVING SPACED APART HEAT SINK

An integrated circuit (IC) package that includes a lead frame, and a die affixed to a first surface of a pad of the lead frame. The die is wire bonded to the lead frame. The package includes a heat sink spaced apart from a second surface of the pad, where the second surface opposes the first surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIM, KEN, BENG, TOONG, TEIK, TIONG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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