CRUCIBLE FOR USE IN A DIRECTIONAL SOLIDIFICATION FURNACE

A directional solidification furnace comprises a crucible assembly including a crucible for containing a melt having walls and a base with an opening therein, a crucible support for supporting the crucible, and a lid covering the crucible. A plate is received in the opening in the base. The plate ha...

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Bibliographische Detailangaben
Hauptverfasser:	KIMBEL, STEVEN L, PHILLIPS, RICHARD J, DESHPANDE, ADITYA J, DEVULAPALLI, BALAJI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR CHEMISTRY CRYSTAL GROWTH METALLURGY PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:	A directional solidification furnace comprises a crucible assembly including a crucible for containing a melt having walls and a base with an opening therein, a crucible support for supporting the crucible, and a lid covering the crucible. A plate is received in the opening in the base. The plate has a higher thermal conductivity than that of the base. The base can include a composite having an additive such that the composite base has a higher thermal conductivity than a comparable without the additive. L'invention concerne un four à solidification directionnelle comportant un ensemble creuset comprenant un creuset destiné à contenir un bain de fusion, doté de parois et d'un fond dans lequel est pratiquée une ouverture, un porte-creuset destiné à soutenir le creuset et un couvercle recouvrant le creuset. Une plaque est logée dans l'ouverture du fond. La plaque présente une conductivité thermique supérieure à celle du fond. Ledit fond peut comporter un composite comprenant un additif tel que le fond composite présente une conductivité thermique supérieure à celle d'un fond comparable dépourvu de l'additif.