SOLDER PASTE

Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MORI, KIMIAKI, ANDOH, YOSHIYUKI, SHIRAI, TAKESHI, AIHARA, MASAMI, UTSUNO, MASAYOSHI, OKOCHI, TERUO, SUKEKAWA, TAKUJI, IKEDO, KENSHI, SANJI, MASAKI, NAKANISHI, KENSUKE, YOSHIOKA, TAKAYASU, WADA, RIE, ISHIGA, FUMIO, KUMAMOTO, SEISHI, GOTOH, KAZUSHI, IWAMURA, EIJI, NAKAMURA, ATSUO
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s. L'invention concerne une pâte à braser qui comprend, au sein d'un flux, un activateur comportant : un acide dibasique dont le poids moléculaire ne dépasse pas 250, un monoacide dont le poids moléculaire se situe entre 150 et 300, et un acide dibasique dont le poids moléculaire se situe entre 300 et 600; et au moins un additif de résine choisi dans le groupe constitué des polyéthylènes haute densité et des polypropylènes. La pâte à braser comprend entre 4% et 12% en masse d'additif de résine au sein du flux, et la viscosité de la pâte à braser à 80°C est d'au moins 400 Pa·s.