SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING

An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot&q...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NADEAU, MARY, GOTHOSKAR, PRAKASH, PATEL, VIPULKUMAR, FANGMAN, JOHN, FANGMAN, JOHN, MATTHEW, WEBSTER, MARK
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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