METHOD FOR MANUFACTURING WOOD BOARD AND WOOD BOARD

The invention relates to a method for manufacturing a wood board, wherein a wood board comprising multiple veneer layers is formed from a number of veneers in such manner that the veneers are laid one above the other and combined by means of glue.In accordance with the invention,at least a part of t...

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Bibliographische Detailangaben
Hauptverfasser:	LIIMATAINEN, JUHANA, NIEMINEN, HARRI, RAUTIAINEN, RAIJA, TIUSANEN, GATJA, KILJUNEN, SAMANTHA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ACCESSORY MACHINES OR APPARATUS ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SAFETY DEVICES, e.g. THOSE FOR SAWS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD
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Beschreibung
Zusammenfassung:	The invention relates to a method for manufacturing a wood board, wherein a wood board comprising multiple veneer layers is formed from a number of veneers in such manner that the veneers are laid one above the other and combined by means of glue.In accordance with the invention,at least a part of the veneers are heat- treated at temperature between 160 to 215 ºC prior to the gluing for reducing moisture in the wood board, and the veneers is glued with the thermoplastic glue including maleic anhydride, and the glue is activated by means of the heat of veneers. Further, the invention relates to a wood board. La présente invention concerne un procédé de fabrication de panneau en bois, selon lequel un panneau en bois comportant une pluralité de couches de placage est formé à partir d'une pluralité de placages de sorte que les placages soient déposés les uns sur les autres et combinés avec de la colle. Selon l'invention, au moins une partie des placages est soumise à un traitement thermique à une température comprise entre 160 et 215°C préalablement au collage pour réduire l'humidité dans le panneau en bois, et les placages sont collés avec de la colle thermoplastique comprenant de l'anhydride maléique, et la colle est activée par la chaleur des placages. L'invention concerne également un panneau en bois.