COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic...

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Bibliographische Detailangaben
Hauptverfasser:	QUILLEN, MICHAEL, WAYNE, MOORE, JOHN, CLEAON, O'DELL, DALE, EDWARD, LEE, ZACHARY, PHILIP, MCENTIRE, EDWARD, ENNS
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. La présente invention concerne des compositions et des procédés utiles pour éliminer des substances organiques de substrats, par exemple de substrats de dispositifs électroniques, tel(le)s que des plaquettes micro-électroniques ou des écrans plats. L'invention concerne en outre un procédé d'application d'un volume minimal de la composition sous forme d'enduit sur un substrat inorganique ajoutant ainsi suffisamment de chaleur, lequel substrat est immédiatement rincé avec de l'eau, afin d'obtenir une élimination complète. Ces compositions et procédés sont particulièrement adaptés à l'élimination et à la dissolution complète de résines photosensibles des variétés positives et négatives, ainsi que de polymères thermo-durcis, des dispositifs électroniques.