METHOD OF ATTACHING ELEMENTS BY BONDING

The present invention relates to a method of attaching a first portion and a second portion to each other, wherein the method comprises - exposing an adhesive for a low temperature in order to obtain a non-tacky adhesive, - arranging the non-tacky adhesive between the two portions, and - curing the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WESTERDAHL, ANDERS, WEIDMANN, BJOERN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention relates to a method of attaching a first portion and a second portion to each other, wherein the method comprises - exposing an adhesive for a low temperature in order to obtain a non-tacky adhesive, - arranging the non-tacky adhesive between the two portions, and - curing the adhesive. Further, the present invention relates to the use of adhesive according to the method. La présente invention concerne un procédé permettant de fixer un premier élément à un deuxième élément, qui consiste à exposer un adhésif à une température réduite afin d'obtenir un adhésif non collant, disposer l'adhésif non collant entre les deux éléments, et durcir l'adhésif. L'invention concerne également l'utilisation d'un adhésif selon ce procédé.