FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE

A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount o-f 1.0 % by weight to 98.0 % by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEFEVRE, PAUL, HSU, OSCAR K
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	GRINDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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