FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE

A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount o-f 1.0 % by weight to 98.0 % by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm a...

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Bibliographische Detailangaben
Hauptverfasser:	LEFEVRE, PAUL, HSU, OSCAR K
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	GRINDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount o-f 1.0 % by weight to 98.0 % by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers. L'invention porte sur un tampon de planarisation chimico-mécanique destiné à la fabrication de semi-conducteur. Le tampon comprend des fibres synthétiques qui sont des fibres non frisées, présentes dans une quantité de 1,0 % en poids à 98,0 % en poids dans le mat, les fibres non frisées ayant une longueur de 0,1 cm à 127 cm et un diamètre de 1,0 à 1 000 micromètres.