LAMINATED COMPOSITE CHIP DEVICE

The present invention relates to a laminated composite chip device in which a common mode filter and a suppressor are implemented in a single chip to remove noise components generated by a high speed data line and to perform an EDS protection for the high speed data line at the same time. The lamina...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JO, MINSOO, HWANG, YOONHO, RYU, JAESU, LEE, JAEWOOK, LIM, BYUNGGUK, JOO, HYUNTAE
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRICITY RESISTORS
Online-Zugang:	Volltext bestellen
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