PRODUCT CHIPS AND DIE WITH A FEATURE PATTERN THAT CONTAINS INFORMATION RELATING TO THE PRODUCT CHIP, METHODS FOR FABRICATING SUCH PRODUCT CHIPS AND DIE, AND METHODS FOR READING A FEATURE PATTERN FROM A PACKAGED DIE

Product chips and die, methods for fabricating product chips, and methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features (85) formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features (80-84)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SWANKE, KARL, VANCE, MALINOWSKI, JOHN, CHESTER, COHN, JOHN, MAXWELL, FLEMMING, MARK, JAMES
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!