FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LOKE, MUN LEONG, MONG, WENG KHOON, ONG, TEAN WEE, LIM, BOK SIM, RUDGE, A VETHANAYAGAM, ONG, KANG EU, LIM, SIH FEI
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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