FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOKE, MUN LEONG, MONG, WENG KHOON, ONG, TEAN WEE, LIM, BOK SIM, RUDGE, A VETHANAYAGAM, ONG, KANG EU, LIM, SIH FEI
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. L'invention concerne, dans certains modes de réalisation, le placage anélectrolytique pour substrats électroniques. Dans cette optique, elle présente un procédé consistant à recevoir une bande de substrat sans noyau, à attacher des billes de brasure à l'arrière de la bande de substrat sans noyau et à former un moule rigidifiant arrière parmi les billes de brasure. L'invention concerne aussi d'autres modes de réalisation.