ADHESIVE ENCAPSULATING COMPOSITION AND ELECTRONIC DEVICES MADE THEREWITH

Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyi...

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Bibliographische Detailangaben
Hauptverfasser:	BHARTI, VIVEK, FUJITA, JUN, MOLLENHAUER, SERENA L, KOBORI, NAMI, MCCORMICK, FRED B
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers. L'invention porte sur des compositions encapsulantes adhésives à usage dans des dispositifs électroniques tels que des dispositifs électroluminescents organiques, des écrans tactiles, des dispositifs photovoltaïques et des transistors à couche mince. Les compositions encapsulantes adhésives comprennent des adhésifs sensibles à la pression comprenant une ou plusieurs résines de polyisobutylène, en combinaison avec des monomères de (méth)acrylate multifonctionnels facultatifs et/ou des agents poisseux facultatifs.