NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION

The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness = 3.0 µm, (ii) a Ni-P layer having a thickness = 1.0 µm, (iii) a Au layer having a thickness = 1.0 µm. L'invention porte sur un système en couches...

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Bibliographische Detailangaben
Hauptverfasser:	RUETHER, ROBERT, DANKER, MICHAEL, BARTHELMES, JUERGEN, KURTZ, OLAF
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness = 3.0 µm, (ii) a Ni-P layer having a thickness = 1.0 µm, (iii) a Au layer having a thickness = 1.0 µm. L'invention porte sur un système en couches comprenant sur un substrat, dont la surface a été polie par électrolyse, (i) une couche de Ni ayant une épaisseur = 3,0 µm, (ii) une couche de Ni-P ayant une épaisseur = 1,0 µm et (iii) une couche d'Au ayant une épaisseur = 1,0 µm.