NON-SELECTIVE OXIDE ETCH WET CLEAN COMPOSITION AND METHOD OF USE

NON-SELECTIVE OXIDE ETCH WET CLEAN COMPOSITION AND METHOD OF USE

Composition and method to remove undoped silicon-containing materials from microelectronic devices at rates greater than or equal to the removal of doped silicon-containing materials. L'invention concerne une composition et un procédé pour éliminer des matières contenant du silicium non dopé de...

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Bibliographische Detailangaben
Hauptverfasser: HURD, TRACE QUENTIN, MINSEK, DAVID, ZHANG, PENG, SONTHALIA, PRERNA, COOPER, EMANUEL, SERKE, BRITTANY, PETRUSKA, MELISSA A
Format: Patent
Sprache:eng ; fre
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Beschreibung
Zusammenfassung:Composition and method to remove undoped silicon-containing materials from microelectronic devices at rates greater than or equal to the removal of doped silicon-containing materials. L'invention concerne une composition et un procédé pour éliminer des matières contenant du silicium non dopé de dispositifs microélectroniques à des taux supérieurs ou égaux au retrait de matières contenant du silicium dopé.