COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM
Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition...
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| creator | AOBA, KAZUHIRO |
| description | Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.
L'invention concerne une composition à solution de résine qui est utilisée pour former un film organique utilisé pour la protection de dispositif au cours du transport eau/puce dans une opération de traitement d'un substrat à semi-conducteur, dans la production de dispositifs à semi-conducteur ou la production de MEMS. L'invention concerne plus particulièrement une composition qui est obtenue en dissolvant une résine soluble dans l'eau dans un solvant organique spécifique qui est sélectionné dans le groupe constitué d'alcools légers, de glycols, d'éthers de glycol, de solvants amides possédant une liaison amide, d'esters d'acide lactique et de sulfoxyde de diméthyle. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2009101938A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2009101938A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2009101938A13</originalsourceid><addsrcrecordid>eNrjZLBx9ncM8fRzV3D29w3wD_YM8fT3U3DzD1IIdvX1dPb3cwl1DgHyXFzDPJ1dFQKC_ENcnSFqPH18eRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGBpaGBoaWxhaOhMXGqANYEKtM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM</title><source>esp@cenet</source><creator>AOBA, KAZUHIRO</creator><creatorcontrib>AOBA, KAZUHIRO</creatorcontrib><description>Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.
L'invention concerne une composition à solution de résine qui est utilisée pour former un film organique utilisé pour la protection de dispositif au cours du transport eau/puce dans une opération de traitement d'un substrat à semi-conducteur, dans la production de dispositifs à semi-conducteur ou la production de MEMS. L'invention concerne plus particulièrement une composition qui est obtenue en dissolvant une résine soluble dans l'eau dans un solvant organique spécifique qui est sélectionné dans le groupe constitué d'alcools légers, de glycols, d'éthers de glycol, de solvants amides possédant une liaison amide, d'esters d'acide lactique et de sulfoxyde de diméthyle.</description><language>eng ; fre ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090820&DB=EPODOC&CC=WO&NR=2009101938A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090820&DB=EPODOC&CC=WO&NR=2009101938A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOBA, KAZUHIRO</creatorcontrib><title>COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM</title><description>Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.
L'invention concerne une composition à solution de résine qui est utilisée pour former un film organique utilisé pour la protection de dispositif au cours du transport eau/puce dans une opération de traitement d'un substrat à semi-conducteur, dans la production de dispositifs à semi-conducteur ou la production de MEMS. L'invention concerne plus particulièrement une composition qui est obtenue en dissolvant une résine soluble dans l'eau dans un solvant organique spécifique qui est sélectionné dans le groupe constitué d'alcools légers, de glycols, d'éthers de glycol, de solvants amides possédant une liaison amide, d'esters d'acide lactique et de sulfoxyde de diméthyle.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBx9ncM8fRzV3D29w3wD_YM8fT3U3DzD1IIdvX1dPb3cwl1DgHyXFzDPJ1dFQKC_ENcnSFqPH18eRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGBpaGBoaWxhaOhMXGqANYEKtM</recordid><startdate>20090820</startdate><enddate>20090820</enddate><creator>AOBA, KAZUHIRO</creator><scope>EVB</scope></search><sort><creationdate>20090820</creationdate><title>COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM</title><author>AOBA, KAZUHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2009101938A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2009</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>AOBA, KAZUHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOBA, KAZUHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM</title><date>2009-08-20</date><risdate>2009</risdate><abstract>Disclosed is a resin solution composition which is used for forming an organic film that is used for device protection during water/chip conveyance in a processing step of a semiconductor substrate in production of semiconductor devices or production of MEMS. Specifically disclosed is a composition which is obtained by dissolving a water-soluble resin in a specific organic solvent which is selected from the group consisting of lower alcohols, glycols, glycol ethers, amide solvents having an amide bond, lactic acid esters and dimethyl sulfoxide.
L'invention concerne une composition à solution de résine qui est utilisée pour former un film organique utilisé pour la protection de dispositif au cours du transport eau/puce dans une opération de traitement d'un substrat à semi-conducteur, dans la production de dispositifs à semi-conducteur ou la production de MEMS. L'invention concerne plus particulièrement une composition qui est obtenue en dissolvant une résine soluble dans l'eau dans un solvant organique spécifique qui est sélectionné dans le groupe constitué d'alcools légers, de glycols, d'éthers de glycol, de solvants amides possédant une liaison amide, d'esters d'acide lactique et de sulfoxyde de diméthyle.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; jpn |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | COATING COMPOSITION FOR SEMICONDUCTOR DEVICE PROTECTION FILM |
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