A HEAT SINK AND METHOD OF FORMING A HEATSINK USING A WEDGE-LOCK SYSTEM

The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second sid...

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Bibliographische Detailangaben
Hauptverfasser:	SLATON, DAVID, S, MCDONALD, DAVID, L
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS WEAPONS
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Beschreibung
Zusammenfassung:	The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element. La présente invention concerne un dissipateur thermique et un procédé de formation d'un dissipateur thermique. Dans un mode de réalisation, un procédé de formation du dissipateur thermique comprend la formation d'au moins un élément en graphite thermo-pyrolytique. Le(dit) élément en TPG comprend un premier côté qui possède une surface en forme de coin et un second côté qui possède une surface plate. Le procédé comprend en outre l'application d'un matériau métallique sur le(dit) élément en TPG, le métal étant configuré pour être complémentaire au premier côté du(dit) élément en TPG, et l'application d'une pression afin de fixer le matériau métallique sur le(dit) élément en TPG.