APPARATUS AND METHOD FOR TREATING A SURFACE BY MEANS OF A DIELECTRIC BARRIER DISCHARGE IN A GAS, ENABLING TWO SUBSTRATES TO BE TREATED SIMULTANEOUSLY
Apparatus for the implementation of a method for continuously treating substrates by a dielectric barrier discharge, enabling two substrates to be simultaneously treated, which apparatus comprises: first and second electrodes, at least one of the electrodes being covered with a dielectric barrier; m...
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| description | Apparatus for the implementation of a method for continuously treating substrates by a dielectric barrier discharge, enabling two substrates to be simultaneously treated, which apparatus comprises: first and second electrodes, at least one of the electrodes being covered with a dielectric barrier; means for feeding at least two substrates into the space between the two electrodes; a means for bringing the first electrode into intimate contact with one of the faces of a first substrate; a means for bringing the second electrode into intimate contact with one of the faces of a second substrate; a means for keeping the second electrode at a constant distance from the first electrode; and a means for supplying the space lying between the two substrates with a treatment gas, said first and second electrodes being connected to a power supply so that the discharge takes place between the electrodes and so as to create a plasma in the treatment gas between the two substrates.
Appareil pour la mise en oevre d'un procédé de traitement en continu de substrats par décharge à barrière diélectrique permettant le traitement simultané de deux substrats, comprenant: une première électrode, une deuxième électrode, l'une au moins des électrodes étant recouverte d'une barrière diélectrique, des moyens d'amenée d'au moins deux substrats dans l'espace entre les deux électrodes; un moyen de mise en contact intime de la première électrode avec l'une des faces d'un premier substrat, un moyen de mise en contact intime de la seconde électrode avec l'une des faces d'un second substrat, un moyen de maintien de la deuxième électrode à une distance constante de la première électrode, un moyen d'alimentation de l'espace situé entre les deux substrats en un gaz de traitement; lesdites première et deuxième électrodes étant reliées à une source d'alimentation électrique de façon à ce que la décharge se fasse entre les électrodes, et de façon à créer un plasma dans legaz de traitement entre les deux substrats. |
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Appareil pour la mise en oevre d'un procédé de traitement en continu de substrats par décharge à barrière diélectrique permettant le traitement simultané de deux substrats, comprenant: une première électrode, une deuxième électrode, l'une au moins des électrodes étant recouverte d'une barrière diélectrique, des moyens d'amenée d'au moins deux substrats dans l'espace entre les deux électrodes; un moyen de mise en contact intime de la première électrode avec l'une des faces d'un premier substrat, un moyen de mise en contact intime de la seconde électrode avec l'une des faces d'un second substrat, un moyen de maintien de la deuxième électrode à une distance constante de la première électrode, un moyen d'alimentation de l'espace situé entre les deux substrats en un gaz de traitement; lesdites première et deuxième électrodes étant reliées à une source d'alimentation électrique de façon à ce que la décharge se fasse entre les électrodes, et de façon à créer un plasma dans legaz de traitement entre les deux substrats.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090702&DB=EPODOC&CC=WO&NR=2009080943A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090702&DB=EPODOC&CC=WO&NR=2009080943A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAHAN, DENIS</creatorcontrib><creatorcontrib>MADEC, ALAIN</creatorcontrib><title>APPARATUS AND METHOD FOR TREATING A SURFACE BY MEANS OF A DIELECTRIC BARRIER DISCHARGE IN A GAS, ENABLING TWO SUBSTRATES TO BE TREATED SIMULTANEOUSLY</title><description>Apparatus for the implementation of a method for continuously treating substrates by a dielectric barrier discharge, enabling two substrates to be simultaneously treated, which apparatus comprises: first and second electrodes, at least one of the electrodes being covered with a dielectric barrier; means for feeding at least two substrates into the space between the two electrodes; a means for bringing the first electrode into intimate contact with one of the faces of a first substrate; a means for bringing the second electrode into intimate contact with one of the faces of a second substrate; a means for keeping the second electrode at a constant distance from the first electrode; and a means for supplying the space lying between the two substrates with a treatment gas, said first and second electrodes being connected to a power supply so that the discharge takes place between the electrodes and so as to create a plasma in the treatment gas between the two substrates.
Appareil pour la mise en oevre d'un procédé de traitement en continu de substrats par décharge à barrière diélectrique permettant le traitement simultané de deux substrats, comprenant: une première électrode, une deuxième électrode, l'une au moins des électrodes étant recouverte d'une barrière diélectrique, des moyens d'amenée d'au moins deux substrats dans l'espace entre les deux électrodes; un moyen de mise en contact intime de la première électrode avec l'une des faces d'un premier substrat, un moyen de mise en contact intime de la seconde électrode avec l'une des faces d'un second substrat, un moyen de maintien de la deuxième électrode à une distance constante de la première électrode, un moyen d'alimentation de l'espace situé entre les deux substrats en un gaz de traitement; lesdites première et deuxième électrodes étant reliées à une source d'alimentation électrique de façon à ce que la décharge se fasse entre les électrodes, et de façon à créer un plasma dans legaz de traitement entre les deux substrats.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjT0KwkAQRtNYiHqHAVuF-FNoObuZJAvJrsxMECsRWStRIV7F-7qiB7D64PF43zB74W6HjNoJoC-gJa1DAWVgUCZU5ytAkI5LtATmkAT0AqFMtHDUkFV2FgwyO-KExNbIFYHzyahQZkAeTfPp6D6kkhFNdySgAQx9X6gAcW3XKHoKnTSHcTa4nK59nPx2lE1LUlvP4-N-jP3jdI63-DzuwzLPt_km365XuFj9Z70BAh5CHg</recordid><startdate>20090702</startdate><enddate>20090702</enddate><creator>JAHAN, DENIS</creator><creator>MADEC, ALAIN</creator><scope>EVB</scope></search><sort><creationdate>20090702</creationdate><title>APPARATUS AND METHOD FOR TREATING A SURFACE BY MEANS OF A DIELECTRIC BARRIER DISCHARGE IN A GAS, ENABLING TWO SUBSTRATES TO BE TREATED SIMULTANEOUSLY</title><author>JAHAN, DENIS ; MADEC, ALAIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2009080943A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>JAHAN, DENIS</creatorcontrib><creatorcontrib>MADEC, ALAIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAHAN, DENIS</au><au>MADEC, ALAIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS AND METHOD FOR TREATING A SURFACE BY MEANS OF A DIELECTRIC BARRIER DISCHARGE IN A GAS, ENABLING TWO SUBSTRATES TO BE TREATED SIMULTANEOUSLY</title><date>2009-07-02</date><risdate>2009</risdate><abstract>Apparatus for the implementation of a method for continuously treating substrates by a dielectric barrier discharge, enabling two substrates to be simultaneously treated, which apparatus comprises: first and second electrodes, at least one of the electrodes being covered with a dielectric barrier; means for feeding at least two substrates into the space between the two electrodes; a means for bringing the first electrode into intimate contact with one of the faces of a first substrate; a means for bringing the second electrode into intimate contact with one of the faces of a second substrate; a means for keeping the second electrode at a constant distance from the first electrode; and a means for supplying the space lying between the two substrates with a treatment gas, said first and second electrodes being connected to a power supply so that the discharge takes place between the electrodes and so as to create a plasma in the treatment gas between the two substrates.
Appareil pour la mise en oevre d'un procédé de traitement en continu de substrats par décharge à barrière diélectrique permettant le traitement simultané de deux substrats, comprenant: une première électrode, une deuxième électrode, l'une au moins des électrodes étant recouverte d'une barrière diélectrique, des moyens d'amenée d'au moins deux substrats dans l'espace entre les deux électrodes; un moyen de mise en contact intime de la première électrode avec l'une des faces d'un premier substrat, un moyen de mise en contact intime de la seconde électrode avec l'une des faces d'un second substrat, un moyen de maintien de la deuxième électrode à une distance constante de la première électrode, un moyen d'alimentation de l'espace situé entre les deux substrats en un gaz de traitement; lesdites première et deuxième électrodes étant reliées à une source d'alimentation électrique de façon à ce que la décharge se fasse entre les électrodes, et de façon à créer un plasma dans legaz de traitement entre les deux substrats.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | APPARATUS AND METHOD FOR TREATING A SURFACE BY MEANS OF A DIELECTRIC BARRIER DISCHARGE IN A GAS, ENABLING TWO SUBSTRATES TO BE TREATED SIMULTANEOUSLY |
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