IMPROVED HOUSING AND MANUFACTURE THEREOF
An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being o...
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| creator | THAN, CHO CHO TAN, TECK BOON, FREDERICK CHIN, YEN, JASON |
| description | An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being of a more rigid material than the surface of the second component.
La présente invention concerne un dispositif électronique comportant un premier composant en engagement étanche avec un second composant dudit dispositif, ledit engagement étanche comprenant un contact entre une partie discontinue du premier composant et une surface continue du second composant, ladite partie discontinue étant réalisée en un matériau plus rigide que la surface du second composant. |
| format | Patent |
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La présente invention concerne un dispositif électronique comportant un premier composant en engagement étanche avec un second composant dudit dispositif, ledit engagement étanche comprenant un contact entre une partie discontinue du premier composant et une surface continue du second composant, ladite partie discontinue étant réalisée en un matériau plus rigide que la surface du second composant.</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090522&DB=EPODOC&CC=WO&NR=2009064253A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090522&DB=EPODOC&CC=WO&NR=2009064253A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>THAN, CHO CHO</creatorcontrib><creatorcontrib>TAN, TECK BOON, FREDERICK</creatorcontrib><creatorcontrib>CHIN, YEN, JASON</creatorcontrib><title>IMPROVED HOUSING AND MANUFACTURE THEREOF</title><description>An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being of a more rigid material than the surface of the second component.
La présente invention concerne un dispositif électronique comportant un premier composant en engagement étanche avec un second composant dudit dispositif, ledit engagement étanche comprenant un contact entre une partie discontinue du premier composant et une surface continue du second composant, ladite partie discontinue étant réalisée en un matériau plus rigide que la surface du second composant.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDw9A0I8g9zdVHw8A8N9vRzV3D0c1HwdfQLdXN0DgkNclUI8XANcvV342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYGlgZmJkamxo5GxsSpAgCldiUd</recordid><startdate>20090522</startdate><enddate>20090522</enddate><creator>THAN, CHO CHO</creator><creator>TAN, TECK BOON, FREDERICK</creator><creator>CHIN, YEN, JASON</creator><scope>EVB</scope></search><sort><creationdate>20090522</creationdate><title>IMPROVED HOUSING AND MANUFACTURE THEREOF</title><author>THAN, CHO CHO ; TAN, TECK BOON, FREDERICK ; CHIN, YEN, JASON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2009064253A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2009</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>THAN, CHO CHO</creatorcontrib><creatorcontrib>TAN, TECK BOON, FREDERICK</creatorcontrib><creatorcontrib>CHIN, YEN, JASON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>THAN, CHO CHO</au><au>TAN, TECK BOON, FREDERICK</au><au>CHIN, YEN, JASON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMPROVED HOUSING AND MANUFACTURE THEREOF</title><date>2009-05-22</date><risdate>2009</risdate><abstract>An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being of a more rigid material than the surface of the second component.
La présente invention concerne un dispositif électronique comportant un premier composant en engagement étanche avec un second composant dudit dispositif, ledit engagement étanche comprenant un contact entre une partie discontinue du premier composant et une surface continue du second composant, ladite partie discontinue étant réalisée en un matériau plus rigide que la surface du second composant.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | IMPROVED HOUSING AND MANUFACTURE THEREOF |
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