IMPROVED HOUSING AND MANUFACTURE THEREOF

An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being o...

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Bibliographische Detailangaben
Hauptverfasser:	THAN, CHO CHO, TAN, TECK BOON, FREDERICK, CHIN, YEN, JASON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device comprising a first component in sealing engagement with a second component of said device, wherein said sealing engagement includes contact between a discontinuous portion of the first component and a continuous surface of the second component, said discontinuous portion being of a more rigid material than the surface of the second component. La présente invention concerne un dispositif électronique comportant un premier composant en engagement étanche avec un second composant dudit dispositif, ledit engagement étanche comprenant un contact entre une partie discontinue du premier composant et une surface continue du second composant, ladite partie discontinue étant réalisée en un matériau plus rigide que la surface du second composant.