THICK FILM RESISTS

The present invention relates to light-sensitive photoresist compositions especially usenful for imaging thick films. The photoresist compositions are provided comprising a resin binder. L'invention concerne des compositions de résine photosensible en couche épaisse.

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Bibliographische Detailangaben
Hauptverfasser:	TOUKHY, MEDHAT A, PAUNESCU, MARGARETA
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to light-sensitive photoresist compositions especially usenful for imaging thick films. The photoresist compositions are provided comprising a resin binder. L'invention concerne des compositions de résine photosensible en couche épaisse.